Foam Peeling Machine

Foam Peeling Machine

Product Description: CSXYQ-2150 Continuous Foam Peeling Machine is mainly used for round foam first for long wafer cutting work , control cutting thickness through change gear the machine also can choose ball screw and servo control system, change the original gear control cutting thickness,......

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Product Description:

CSXYQ-2150 Continuous Foam Peeling Machine is mainly used for round foam first for long wafer cutting work, control cutting thickness through change gear the machine also can choose ball screw and servo control system, change the original gear control cutting thickness, using the latest digital control technology, the operation is more flexible, more accurate cutting precision.

Technical Specification:

Model

CSXYQ-2150

Max cutting size

Φ2000X2150mm

Cutting thickness range

2~25mm

Total power

6.59kw

Peeling speed

25m~30m/min

Thickness control

Gear control

Machine weight

1800kg

Machine size(L*W*H)

4560x1650x1950mm

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